Specification :

"
Item" "
Producing Capability"
Layer 1-20 lays( including rigid and flexible circuit)
Panel size max: 250* 550( mm)
Drilling diameter " Max. Diameter: 6.5mm ( 256mil)
Min. Diameter: 0.20mm ( 8mil) "
Base Material Copper Thickness " Max.: 0.105mm( 4mil)
Min.: 0.012mm( 0.5mil) "
Insulating Layer Thickness " Max.: 0.05mm( PI) ( 2mil)
Min: 0.0125mm( PI) ( 0.5mil) "
Electroplating Sn/ Pb Thickness 3 um --- 20 um
Electroplating Au/ Ni Thickness " Au: e0.05um
Ni: 1um--5um"
Chemical Immersion Ni/ Au Thickness 0.05 um --- 0.1 um
Electroplating Sn Thickness 3 um --- 20 um
Etching Line Width & Space: " S/ S: 2.5mil ( 0.06mm)
D/ S: 2.5mil ( 0.06mm) "
Etching Tolerance Width: ± 20% ; Special Width: ± 10%
Outline Tolerance( from side to side) ± 0.05mm( ± 2mil)
Parts Fixed Position Tolerance ± 0.2mm ( 8mil)
Finishing Treatment " Immersion Gold, Immersion Tin
Plating Gold, Plating Tin
OSP, etc."
Soldermask Green, White, Black
E-Testing 100% E-Testing ( High Voltage Testing) ; Flying Probe Testing
Other test ImpedanceTesting, Resistance Testing, Microsection etc.,